Documentation for “Zerocat Chipflasher: Kit User Guide”
Generated on: Sat, 07 Dec 2024 11:41:31 +0100
Repository: git://zerocat.org/zerocat/projects/chipflasher.git
Board: board-v2.0.0-1495-05a6c4fe7
Version: v2.0.5-18-05a6c4fe7
Branch: master
Chipflasher v2, assembled from scratch
Chipflasher v2 Kits
PCBs
Components
Kit: Scope of delivery
Kit: Bags purged
Set of Tools: Solder Iron and Accessories
Set of Tools: Probe and Cooking Plate
Cut like 20cm of Power Cable and get prepared: Locate wires marked with white stripes
Join marked wires, join black wires, apply solder, grind joints to make them narrow
Solder plug, use marked wires for lower, 5VDC contact; avoid short circuits to data pins and chassis
Cut handle to provide more space for quadruple wires
Place plug into handle, seal plastics with hot tip, then grind handle to make it look nice again
Solder second plug to remaining end of short power cable, again use marked wire for lower, 5VDC contact
Place plug into plastic handle, seal it again with hot tip
Done.
Take data cable, dismantel like 4cm and mount cable stop.
Solder wires, maintain color codes.
Mount plug handles.
Other end of cable: Dismantel like 3cm, push back shield and seal with solder.
Add a small piece of mantel.
Press wires into plug.
Close plug, cut in excess wires.
Finalize plug by adding cable stop.
Done.
Get started: Dismantel like 3cm of shielded clock cable.
Push back shield, twist, apply solder.
Dismantel clock wire, lenghten shield extension.
Connect clock wire and shield to 9×1 pinheader plug.
Cut gray piece of tube.
Add all missing wires while preserving color codes, bundle wires with tube.
Other end of clock cable: Dismantel like 2cm, prepare shield for dead-end.
Seal shield with solder.
Pair clock wire with green cable, neighbouring the yellow wire.
Pair colored wires with their neighbouring green wires.
Done.
Add two 4×1 pinheader to DIL8 Socket.
U5: Preheat on Cooking Plate
U5: Fix position using one pin
U5: Turn plate on for 5 seconds, solder tab using 1mm solder.
U5: Solder pins using 0.5mm solder
U5: Done.
U7: Place U7, still on Cooking Plate
U7: Fix position using on pin
U7: Turn Plate on for another 5 seconds, solder tab using 1mm solder
U7: Solder other pins using 0.5mm solder, done
Change solder tip, clean tip on wet cloth
Q1: Place MOSFET, put screwdriver nearby, preheat PCB for 3 to 5 seconds
Q1: Add solder to tip, fix Q1 with screwdriver and solder first pad
Q1: Solder other pads, make sure pins of R3 and R10 are not polluted
Q1: Check electrical connection with probe, done
CONN1: Move PCB onto breadboard, place part, change solder tip (careful, it’s hot!)
CONN1: Flip PCB, locate pins
CONN1: Solder pins using 1mm solder, first heat pads, then heat pins! Be quick!
CONN1: Solder GND pin, use full surface of solder tip to apply heat as fast as possible!
CONN1: Uooh, part became too hot, it is melted. How to apply heat in a faster way??
CONN1: Check mechanical functionality
J2: Place part
J2: Fix on PCB with tape
J2: Solder one center pin
J2: Check proper, flat position on PCB
J2: Solder next center pin
J2: Solder remaining pins, GND pin set as thermal will heat up like 3 times slower
U1 Socket: Place socket on PCB
U1 Socket: Fix with tape
U1 Socket: Solder center pins, do not start with thermals!
U1 Socket: Check for flat socket position on PCB
U1 Socket: Solder pairs of first and last pins, check for flat position again
U1 Socket: Solder remaining pins, thermals will heat up like 3 to 5 times slower!
U1 Socket: Done
U6 Socket: Place on PCB, fix with tape
U6 Socket: Solder two diagonal edge pins, check for flat socket position
U6 Socket: Solder remaining pins, thermals will heat up slower!
U6 Socket: Done
U2 Socket: Place on PCB, fix with tape
U2 Socket: Solder two diagonal pins, but do not start with thermals!
U2 Socket: Thermals are difficult to solder if not hot enough
U2 Socket: Remove solder using desolder wire, if available
U2 Socket: If available, add resin to ease tin flow
U2 Socket: Be patient with thermals, first add enough heat, then solder.
U4 Socket: Place socket on PCB, fix with tape
U4 Socket: Solder diagonal pins
U4 Socket: Check flat position on PCB
U4 Socket: Solder remaining pins
J1: Place 90° pinheader on PCB, fix with tape
J1: Solder two pins, do not start with thermals
J1: Solder remaining pins except thermal pin
J1: Solder thermal pin, it will heat up slower, be careful that plastic will not melt
J1: Check solder on component side, fix if required
J3: Place pinheader on PCB
J3: Fix with tape, then solder
CONN2: Place pinheader on PCB, fix with tape, solder one pin
CONN2: Check angle of pinheader, fix if required, solder remaining pins
CONN2: We are done with sockets, pinheaders and connectors
U6 Capacitors: Hold PCB upside down, place U6 capacitors
U6 Capacitors: Bent leads such that caps won’t fall
U6 Capacitors: Solder one pin each
U6 Capacitors: Adjust positions of caps such that they look nice in a row
U6 Capacitors: Solder remaining pins
U6 Capacitors: Cut leads
U6 Capacitors: Check pins on component side
U6 Capacitors: Apply heat and solder where missing
U6 Capacitors: Done
C11: Place capacitor on PCB
C11: Bent leads such that it remains in place
C11: Solder pin well to ensure electrical connection of top and bottom power routes
C11: Fix solder on component side if required, adjust position
C11: Solder thermal pin well, it will heat up like 3 to 5 times slower
C11: Cut leads
C12, C13, C14, C15: Flip PCB upside down, place capacitors on PCB
C12, C13, C14, C15: Bent leads such that they remain in place, solder pins, cut leads
C5: Flip PCB upside down, place capacitor, bent leads
C5: Check polarity: Thermal pad must be connected with shorter lead!
C5: Solder pins on both sides, cut leads
C2, C4: Flip PCB upside down, place capacitors, bent leads, solder one pin each
C2, C4: Adjust positions
C2, C4: Solder pins on both PCB sides, cut leads
V1: Place fuse on PCB, bent leads such that it remains in place
V1: Solder pins on both sides of PCB, cut leads
Z1: Prepare form factor, bent leads
Z1: Place diode on PCB, bent leads on bottom side to make it remain in place
Z1: Solder pins, cut leads, apply heat again
Z1: Fix solder on component side
D8: Prepare form factor, bent leads
D8: Place diode on PCB, bent leads to make it remain in place, solder pins
D8: Fix solder on component side, if required
U3: Place component on PCB
U3: Slightly bent leads to make component remain in place, solder pins, cut leads
U8: Place component on PCB
U8: Solder one center pin, check for flat position on PCB
U8: Solder remaining pins, thermals will heat up like 5 times slower!
U8: Remove protective foil
U8: Clean-up, check mechanical function of switches
R12: Place component on PCB, align dotted pin to square pad
R12: Solder one pin
R12: Check for flat position on PCB
R12: Apply heat, fix position
C1, C3: Flip PCB 90°, place capacitors on PCB
C1, C3: Solder pins, cut leads, apply heat again to make solder look nice
D1, D2, D3, D4, D5: Collect components
D1, D2, D3, D4, D5: Place components on PCB, spread leads slightly, make sure that longer lead will contact squared pad!
D1, D2, D3, D4, D5: Pull LEDs until flat lead markings disappear on bottom side
D1, D2, D3, D4, D5: Solder pins, apply heat as short as possible!
D1, D2, D3, D4, D5: Do not try to apply solder on component side, additional heat will break LEDs!
R3..R11, R23: Collect components, check color code
R4, R5, R8, R9: Place components on PCB, fix with tape
R4, R5, R8, R9: Apply solder on bottom side
R4, R5, R8, R9: Cut leads
R4, R5, R8, R9: Check solder on component side
R4, R5, R8, R9: Add solder on component side if missing
R6, R7, R11: Adjust form factor
R6, R7, R11: Place on PCB, add solder on bottom side
R6, R7, R11: Check pad on component side
R6, R7, R11: Add solder on top side, if missing
R3, R10, R23: Prepare form factor
R3, R10, R23: Place on PCB, solder pins, cut leads, fix solder on component side if missing
R15, R16, R17, R18, R22: Collect components, check color code
R15, R16, R17: Place components on PCB, spread leads slighly to make them remain in place
R18, R22: Apply solder on bottom side
R15, R16, R17: Apply solder on bottom side
R15, R16, R17, R18, R22: Cut leads to make soldered pads look nice
R21: Prepare form factor, check color code
R21: Place component on PCB, solder pads
R21: Fix solder on component side, if necessary
R2: Prepare form factor, check color code
R2: Place on PCB, solder pads, cut leads, fix solder on component side
R19, R20: Collect components, check color code
R19, R20: Prepare form factor
R19: Apply solder on bottom side, then cut leads
R20: Apply solder on bottom side, then cut leads
R19: Apply solder on component side, if necessary
R1: Collect component, check color code
R1: Place on PCB, apply solder, cut leads, fix solder on component side
R13, R14: Collect components, check color codes, adjust form factor
R14: Place component, apply solder on bottom side
R13: Place component, apply solder on bottom side
R13, R14: Fix solder on component side, if necessary
CONN2 Plug: Add solder to group of pins, use 1mm solder to be faster
Plugs for CONN2 and J3: Place plugs onto pinheaders
Panel: Collect Acrylic Glass and Power Switch
Panel: Mount Power Switch
Panel: Protect Acrylic Glass with Cardboard
Panel: Prepare power wires and solder them to switch pins
Panel: Remove cardboard
Microchips: Collect chips, observe precautions for electrostatic sensitive devices!
Microchips: Press chip down on flat surface in order to put pins towards 90° angle
Microchips: Sort all pins into socket until chip is horizontal, then press down
Microchips: Sort pins into socket ...
Microchips: .. then press down
Microchips: Sort pins into socket ...
Microchips: ... then press down
Microchips: Sort pins into socket ...
Microchips: ... then press down
PCB fully populated, done!
Chassis: Collect bolts and screws and mount them to the PCB
Chassis: Grab Device Panel and solder Power Switch Cables ...
Chassis: ... to CONN1 Plug
Chassis: Unplug Power Switch, fix label with transparent tape below glass
Chassis: Use multiple stripes to seal paper
Chassis: Flip panel, cut stripes along edge
Chassis: Mount panel with screwdriver, apply Power Switch Plug
Device Test: Power on (D5 lights up), Firmware upload (D1..D3 blink two times)
Device Test: Flashrom Probe (D4 lights up)
Chipflasher v2 is ready to use!
Eurocircuits is a professional PCB manufacturer, which has been chosen to process the exported chipflasher ZIP archive. In October 2022, an order of 10 PCBs was processed in no time, resulting in high quality PCBs and one extra PCB as a gift!
Chipflasher v2 PCB
However, this document is not a recommendation to use Eurocircuits, as their web service depends on many third party services and lots of proprietary scripts. A trial to circumvent the Google Service dependency failed as the Captcha Service cannot be avoided. :-/
Screenshots are not provided here, as website usage is bound to their terms of use: https://www.eurocircuits.com/termofuse/
“This website contains material which is owned by or licensed to us.
This material includes, but is not limited to, the design, layout,
look, appearance and graphics. Reproduction is prohibited other than
in accordance with the copyright notice, which forms part of these
terms and conditions.”
Find the website here: https://www.eurocircuits.com/
Reduce the browser’s page display to 80%, as otherwise some buttons of their website won’t show up.
The ordering process is pretty straight forward, once you managed to create an account. Sign in/Register.
This document now should help you to fill in proper settings for their PCB-Configurator:
Go to: https://be.eurocircuits.com/shop/assembly/configurator.aspx
Select your preferred language, i.e.: English
Set Unit: Inch
Browse your disk and provide chipflasher-fa7ba6995.zip
for upload.
The site will discover that standard board sizes are slightly exceeded, press OK button.
Specify/check Number of Layers: 2
Specify/check PCB size: 3.15 x 3.95 inch
Specify Delivery Format: Single PCB
Specify value for eC-registration compatible PCB: No
Stencils
Material
PCB Definition
Technology
Advanced options
Locate the button Proceed to Summary and click on it.
Summary
You can download the Basket PDF to review all details of their offer.
Enable the checkbox at the beginning of the summary line and click on Proceed to checkout.
Checkout items
All items will be listed again along with delivery address, invoice address and prices.
Now hit the final Submit button to launch the manufacturing process.
Details of the submitted order are presented for review. A technician will check all settings provided, and will contact you if things do not match.
Done! Good Luck!
Firma
SEGOR-electronics GmbH
Kaiserin-Augusta-Allee 94
10589 D-Berlin
Telefon: +49 30 4399843
Telefax: +49 30 4399855
email: sales@segor.de
Web: https://www.segor.de/
This list is meant to provide you with vendor’s part names to ease communication. Please check and verify quantities. This list might be incomplete.
Pos. | Artikelbezeichnung | Zusatzbezeichnung
------|-----------------------------|-------------------------------
1 | Q 5,0 MHz-LP | Quarz HC49/U-S LowProfile
2 | DILLAB08 | Präzisionssockel DIL08
3 | DILLAB14 | Präzisionssockel DIL14
4 | DILLAB16 | Präzisionssockel DIL16
5 | DILLAB40 | Präzisionssockel DIL40
6 | AWHW 10/Import | Steckerwanne 10pol 180°
7 | DCBU 2,1-LF | DC-Printbuchse i=2,1mm
8 | DCST 2,1/5,5-90°-1,5m | DC-Winkelstecker+Kab 1,5m
9 | SL1x40-90G | Stiftl.1x40p 90°flach gew
10 | SL1x40-180G | Stiftl.1x40pol 180°
11 | FLLAB 1x36-180G | Federl.36pol 180° RM2,54
12 | USB-A ST +Kappe/sw | USB-A Stecker 4pol
13 | MAX 3232 CPE+ | RS232 Transceiver DIP16
14 | 74HC 32 N | Quad 2-In OR IP14
15 | LD 1117 S33 | V-Reg LDO 3,3V 1% SOT223
16 | 24LC256 P | 32Kx8 I2C-EEPROM DIP8
17 | RXEF 075 | Multifuse Ih=0,75 It=1,5A
18 | ZD 6V8 1,3W | Z-Diode 6,8V 1,3W DO41
19 | Jumper | Jumper RM 2,54mm vergold.
20 | 1N 4007 | 1000V 1A Universal-Diode
21 | ELRA 100u-63/105° | 100uF-63V 10x12,5mm RM5
22 | TA 10u-16 | Tantal 10uF-16V 20% RM2,5
23 | 1n0-R5.0-Y5P | 1nF-100V 20% RM5
24 | IRLML 6402 | PMOS LL 20V 3,7A SOT23
25 | u10-R2.5-Z5U/100x | 100nF-50V 20% Z5U RM2,5
26 | u10-R2.5-X7R | 100nF-50V 10% X7R RM2.5
27 | LED 3 rt-dif | LED 3mm rot diffus 630nm
28 | LED 3 or-dif | LED 3mm orange 610nm
29 | LED 3 gn-dif | LED 3mm grün diffus 565nm
30 | LED 3 ge-dif | LED 3mm gelb diffus 590nm
31 | MF 91R-1% | 91R 1% 0,6W/70° 0207
32 | SIL 8x 47k | SIL-Netzwerk 8x47k
33 | P8X 32A-D40 | 32-Bit 80MHz 32k DIP40
34 | MF 220R-1% | 220R 1% 0,6W/70° 0207
35 | MF 10k-1% | 10k 1% 0,6W/70° 0207
36 | MF 1k0-1% | 1,0k 1% 0,6W/70° 0207
37 | MF 100k-1% | 100k 1% 0,6W/70° 0207
38 | MF 150k-1% | 150k 1% 0,6W/70° 0207
39 | MF 2k2-1% | 2,2k 1% 0,6W/70° 0207
40 | DSQ 10/rot | Druckschalter 1xEIN quadr
41 | AWP 10/Import | Pfostenfeldverbinder 10p.
42 | M3x25 II -8x | 8 Abstandsbolzen M3x25mm
43 | ASH 3x15 -20x | 20 Abstandshülsen 15mm sw
44 | M3x10 LK-100x | 100 Linsenkopfschrauben
45 | M3x25 LK- 50x | 50 Linsenkopfschrauben
46 | U 3,2M -100x | 100 Unterlegscheiben 3,2
47 | ESD-Etiketten (1000x) | 1000 Stck 37x76mm Rolle
48 | PB 0 (100x) | 100 ESD-Beutel pink 60u
49 | Plexiglas 120x250x3 | Acrylglas, glänzend s=3mm
50 | DS09-POST | Kabelkappe 9pol metallis.
51 | HS 152x254/Zip (100x) | 100 ESD HighShield-Beutel
52 | MY 514 sw | NF-Kabel 5x0,14mm2 schw.
53 | DS09 F | Buchse 9pol Lötkelch
Position 7, DC barrel jack input, is of special significance!
This part is plugged into CONN1 location of the Chipflasher v2 PCB. The footprint has been adjusted to match this vendor’s part. Unfortunately, this part is a noname product, imported from Asia. There is no datasheet available, and consistency of dimensions, footprint and material cannot be guaranteed over time.
The vendor recommends to use a part of better quality, made by manufacturer “CUI”, type PJ-202AH. However, this part has a different land pattern:
Pos. | Artikelbezeichnung | Zusatzbezeichnung
------|-----------------------------|-------------------------------
7 | DCBU 2,1-LF;CUI | DC-Printbuchse i=2,1mm
Position 49 is a workaround, as acrylic glass with 4mm thickness is not available.